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Atomfair Nickel sulfamate H4N2NiO6S2

Description Nickel Sulfamate (CAS No. 13770-89-3) is a high-purity inorganic compound with the molecular formula H4N2NiO6S2, also known by its IUPAC name nickel(2+);disulfamate . This compound is widely utilized in electroplating applications due to its exceptional solubility and stability in aqueous solutions, providing a smooth, low-stress nickel deposit with superior adhesion properties. Our Nickel Sulfamate is rigorously tested for purity and consistency, ensuring optimal performance in industrial and research settings. Available in various packaging options to suit laboratory and bulk-scale requirements, this product is ideal for advanced metallurgical processes, electronics manufacturing, and corrosion-resistant coatings. Store in a cool, dry place…

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Description

Description

Nickel Sulfamate (CAS No. 13770-89-3) is a high-purity inorganic compound with the molecular formula H4N2NiO6S2, also known by its IUPAC name nickel(2+);disulfamate. This compound is widely utilized in electroplating applications due to its exceptional solubility and stability in aqueous solutions, providing a smooth, low-stress nickel deposit with superior adhesion properties. Our Nickel Sulfamate is rigorously tested for purity and consistency, ensuring optimal performance in industrial and research settings. Available in various packaging options to suit laboratory and bulk-scale requirements, this product is ideal for advanced metallurgical processes, electronics manufacturing, and corrosion-resistant coatings. Store in a cool, dry place away from incompatible materials.

  • CAS No: 13770-89-3
  • Molecular Formula: H4N2NiO6S2
  • Molecular Weight: 250.87
  • Exact Mass: 249.886420
  • Monoisotopic Mass: 249.886420
  • IUPAC Name: nickel(2+);disulfamate
  • SMILES: NS(=O)(=O)[O-].NS(=O)(=O)[O-].[Ni+2]
  • Synonyms: Nickel sulfamate, 13770-89-3, Nickel(II) sulfamate, Sulfamic acid, nickel(2+) salt (2:1), EINECS 237-396-1

Application

Nickel Sulfamate is primarily used in electroplating baths to produce high-quality nickel coatings with low internal stress and excellent ductility, making it ideal for precision engineering components. It is also employed in the fabrication of printed circuit boards (PCBs) and semiconductor devices due to its reliable conductive properties. Additionally, this compound serves as a catalyst in organic synthesis and as a precursor for advanced material research.

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